october 2006 rev 2 1/9 stth2r02 ultrafast recovery diode main product characteristics features and benefits very low conduction losses negligible switching losses low forward and reverse recovery times high junction temperature description the stth2r02 uses st's new 200 v planar pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. packaged in do-15, sma, and smb, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. order codes i f(av) 2 a v rrm 200 v t j (max) 175 c v f (typ) 0.7 v t rr (typ) 15 ns part number marking stth2r02q stth2r02 stth2r02qrl stth2r02 STTH2R02A r2a stth2r02u r2u k a k a do-15 stth2r02q sma STTH2R02A smb stth2r02u k k a a www.st.com
characteristics stth2r02 2/9 1 characteristics to evaluate the conduction losses use the following equation: p = 0.68 x i f(av) + 0.06 i f 2 (rms) table 1. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i frm repetitive peak forward current do-15 (1) t p = 5 s, f = 5 khz 60 a sma, smb i f(rms) rms forward current do-15 60 a sma, smb i f(av) average forward current, = 0.5 do-15 t lead = 90 c 2a sma, smb t c = 90 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature 175 c 1. on infinite heatsink with 10 mm lead length table 2. thermal parameters symbol parameter value unit r th(j-c) junction to lead lead length = 10 mm on infinite heatsink do-15 45 c/w junction to case sma, smb 30 table 3. static electrical characteristics symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 3 a t j = 125 c 2 20 v f (2) forward voltage drop t j = 25 c i f = 6 a 1.20 v t j = 25 c i f = 2 a 0.89 1.0 t j = 100 c 0.76 0.85 t j = 150 c 0.70 0.80 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 %
stth2r02 characteristics 3/9 table 4. dynamic characteristics symbol parameter test conditions min. typ max. unit t rr reverse recovery time i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 23 30 ns i f = 1 a, di f /dt = -100 a/s, v r = 30 v, t j = 25 c 15 20 i rm reverse recovery current i f = 2 a, di f /dt = -200 a/s, v r = 160 v, t j = 125 c 34 a t fr forward recovery time i f = 2 a, di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 40 ns v fp forward recovery voltage i f = 2 a, di f /dt = 100 a/s, t j = 25 c 2.0 v figure 1. peak current versus duty cycle figure 2. forward voltage drop versus forward current (typical values) i m (a) 0 20 40 60 80 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t d =tp/t tp i m t =tp/t tp i m p = 2 w p = 2 w p = 1 w p = 1 w p = 5 w p = 5 w 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 i fm (a) t j =25c t j =150c v fm (v) figure 3. forward voltage drop versus forward current (maximum values) figure 4. relative variation of thermal impedance junction to case versus pulse duration (sma) 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 i fm (a) t j =25c t j =150c v fm (v) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z th(j-a) /r th(j-a) single pulse sma s cu =1cm2 t p (s)
characteristics stth2r02 4/9 figure 5. relative variation of thermal impedance junction to case versus pulse duration (smb) figure 6. relative variation of thermal impedance junction to case versus pulse duration (do-15) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z th(j-a) /r th(j-a) single pulse smb s cu =1cm2 t p (s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z th(j-a) /r th(j-a) single pulse do-15 lleads=10mm t p (s) figure 7. junction capacitance versus reverse applied voltage (typical values) figure 8. reverse recovery charges versus di f /dt (typical values) 1 10 100 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v) 0 10 20 30 40 50 60 10 100 1000 q rr (nc) i f =2a v r =160v t j =125c t j =25c di f /dt(a/s) figure 9. reverse recovery time versus di f /dt (typical values) figure 10. peak reverse recovery current versus di f /dt (typical values) 0 10 20 30 40 50 60 10 100 1000 t rr (ns) i f =2a v r =160v t j =125c t j =25c di f /dt(a/s) 0 1 2 3 4 5 6 10 100 1000 i rm (a) i f =2a v r =160v t j =125c t j =25c di f /dt(a/s)
stth2r02 ordering information scheme 5/9 l 2 ordering information scheme figure 11. dynamic parameters versus junction temperature figure 12. thermal resistance, junction to ambient, versus copper surface under each lead - sma/smb (epoxy fr4, e cu = 35 m) figure 13. thermal resistance, junction to ambient, versus copper surface under each lead do-15 (epoxy fr4, e cu = 35 m) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;i rm [t j ]/q rr ;i rm [t j =125c] i rm q rr i f =2a v r =160v t j (c) 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r th(j-a) (c/w) sma smb s cu (cm2) 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r th(j-a) (c/w) do-15 s cu (cm2) stth 2 r 02 xxx ultrafast switching diode average forward current 2 = 2 a 02 = 200 v q = do-15 in ammopack qrl = do-15 in tape and reel a = sma in tape and reel u = smb in tape and reel model r package repetitive peak reverse voltage
package information stth2r02 6/9 3 package information epoxy meets ul94, v0 table 5. do-15 dimensions figure 14. sma footprint (dimensions in mm) ref. dimensions millimeters inches min. max. min. max. a 6.05 6.75 0.238 0.266 b 2.95 3.53 0.116 0.139 c 26 31 1.024 1.220 d 0.71 0.88 0.028 0.035 table 6. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.03 0.075 0.080 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 d 2.25 2.95 0.089 0.116 l 0.75 1.60 0.030 0.063 d b a cc 1.67 4.94 1.73 1.48 1.73
stth2r02 package information 7/9 figure 15. smb footprint (dimensions in mm) in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 7. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.15 2.45 0.075 0.085 0.096 a2 0.05 0.15 0.20 0.002 0.006 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 e 5.10 5.40 5.60 0.201 0.213 0.220 e1 4.05 4.30 4.60 0.159 0.169 0.181 d 3.30 3.60 3.95 0.130 0.142 0.156 l 0.75 1.15 1.60 0.030 0.045 0.063 d e e1 c a1 a2 b l 2.22 1.75 1.75 1.75 5.25
ordering information stth2r02 8/9 4 ordering information 5 revision history part number marking package weight base qty delivery mode stth2r02q stth2r02 do-15 0.4 g 1000 ammopack stth2r02qrl stth2r02 do-15 0.4 g 6000 tape and reel STTH2R02A r2a sma 0.068 g 5000 tape and reel stth2r02u r2u smb 0.12 g 2500 tape and reel date revision description of changes 03-may-2006 1 first issue 13-oct-2006 2 maximum t j set to 175 c for all packages in table 1.
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